i-Sense

 Members 

• Fay Misichroni, Team Leader
• Theodoros Theodoropoulos , Sub team Leader - Embedded Firmware
• Spyros Bolierakis, Sub Team Leader - Augmented and Virtual Reality 
• Maria Krommyda, Sub Team Leader - Data Management and Provision
• Vasilis Nousis, Sub Team Leader - Visualization
• Markos Antonopoulos, Sub Team Leader - Data Analysis & Machine Learning
• Thanasis Douklias, Sub Team Leader -   Embedded Hardware 
• Aris Dadoukis, Sub Team Leader - Data Transportation and Transformation 
• Angelos Stamou
• Giorgos Drainakis
• Nikolaos Tousert
• Dr. Anastasios Rigos
• Georgios Xatzipaulis
• Orestis Sampson
• Pavlos Kuqo
• Nikolaos Mitro
• Nikolaos Iliakis 
• Katerina Voulgari
• Katerina Argyri 
• Manos Vasilopoulos 
• Thomas Papaioannou 
• Konstantinos Petousakis
• Dimitrios Kosyvas 
• Giorgos Vosinakis
• Marios Palazis-Aslanidis
• Katerina Georgiou 

Equipment and Infrastructure: 

• 3d Printer: Ultimaker 3 that has advanced active leveling, stiffer build platform, heated build plate, and accurate stepper drivers.
• Mixed Domain Oscilloscope (MDO3000) that can capture analog, digital and RF signals with one scope. More specifically it features six instruments: Oscilloscope (2 analog channels, 100 MHz bandwidth, 2.5 GS/s sample rate), Spectrum Analyzer (frequency range 9 kHz - 3 GHz, -130 dBm to +20 dBm), Arbitrary Function Generator, 16 digital channels, Logic Analyzer, Protocol Analyzer (I2S, TDM, CAN, RS-232/485/UART, USB etc.), Digital Voltmeter / Frequency Counter.
• PCB reflow even 
• UAV - Octacopter UAV (DJI S1000) with add-on vision and spectral sensors, integrated 3-axes stabilized gimbal, intelligent flight systems, live HD view, ground control station, communication and telemetry link for surveillance, identification and tracking applications, on board processing capabilities using embedded GPU. 
• Multispectral sensing equipment: hyperspectral sensor, thermal sensors, UV sensor, short wave infrared (SWIR) sensor, HD IP cameras including an FPGA and single board computer for object, motion and obstacle detection.
• 3D Laser Scanner and LiDAR sensor.
• Portable power solutions (gas powered generator, battery powered AC power supply)
• Wireless and wired communication equipment: 3G/LTE routers, wireless point to point and point to multipoint links (2.4/5GHz), Wi-Fi access points, Gigabit Ethernet switching equipment (including PoE).
• Satellite communications: Dual Mode BGAN M2M & Cellular Terminal
• Wireless sensor network module: several wireless sensor nodes including routers and coordinators based on Zigbee Pro WSN communication protocol.
• Several Fanless industrial and small form factor PCs (Intel NUC, Protectli, On-Logic) 
• Several low-cost single-board computers (Arduino, Raspberry Pi, BeagleBone etc.,)
• Cloud infrastructure and virtualization environment:  2x Dell Poweredge R930 Server (72CPUs, 512GB RAM) with Proxmox VE, Dell Poweredge R910 Server (40 CPUs, 512 GB Ram) with Proxmox VE
• GPUs: 3 x GeForce RTX 3090 (10496 nVIDIA CUDA cores, 24GB GDDR6X) , GeForce TITAN V RTX: (4608 nVIDIA CUDA cores, 24 GB GDDR6), 4 x GeForce RTX 3070 (5888 nVIDIA CUDA cores, 8 GB GDDR6)
• VR/AR lab/ equipment: Several head mounted displays, mobile VR system (Microsoft HoloLens, Vuzix M400 etc.) , with active stereo, VR Powerwall with passive stereo and development tools (Unity3D, Lightning, Delta3D, VIRTOOLS, QUEST)
• Wearable devices for bio-monitoring, tracking and tracing: several wearable devices (tags) and several Base Stations for indoor track and tracing, several wrist bands with bio-monitoring functionalities.
• Portable devices: Mobile phones (Android, iOS), tablets and smartwatches